COM-HPC Mini Academy: A Multi-Vendor Outlook Panel

COM-HPC Mini, like all PICMG specifications, is open, interoperable, and available from multiple suppliers. This creates a dynamic of price competition, reduced vendor lock-in, supply chain resiliency, and ongoing innovation that helps drive industry forward. Featuring several suppliers responsible for developing the COM-HPC Mini specification, this COM-HPC Mini Academy panel discussion will field design and deployment questions from attendees while also advising on the differences between COM Express and COM-HPC; best practices for designing the new specification into real-world applications; and provide insight into PICMG technology roadmaps that will prepare you and your company for the next-generation intelligent edge.