BGA Reballing and Replace Step By Step Full Process in Hindi (#001)

Hello Engineers, I’m Prosanta Biswas From Kolkata, West Bengal, India, and i’m an Electronics Hardware Design Engineer. if you have any query feel free to contact me: Email: prosantalok085@ WhatsApp: 91 6291579068 What is BGA (Ball Grid Array) and Why BGA is Needed? BGA or Ball Grid Array is one type of packaging for Surface Mount Technology (where SMD electronic components are actually mounted or affixed on the surface of the SMT printed circuit board). A BGA package has no leads or pins. The Ball Grid Array gets its name because it is basically an array of metal alloy balls arranged in a grid. These BGA Balls are normally Tin/Lead (Sn/Pb 63/37) or Tin/Silver/Copper (Lead-Free). Advantages of BGA over SMD The PCB or Printed Circuit Board in today’s electronic devices and gadgets are densely populated with electronic components. The size of the Circuit Board will increase with increase in number of electronic components. In order to squeeze the size of the