The Bring Up: Computex 2021 and Revolutionary 3D Chiplets

We Bring Up: Dr. Lisa Su’s keynote at Computex 2021 and discuss AMD’s breakthrough in 3D Chiplet Technology, including why vertical stacking is used and how AMD bonds their chips together. Plus, Bridget makes “Chocolate Chiplet Cookies“. Chapters 01:10 - AMD Computex Keynote Highlights 03:28 - Why 3D Stacking? 05:07 - Oscilloscope Magic 07:40 - Chip Connection Showdown *** Subscribe: Like us on Facebook: Follow us on Twitter: Follow us on Twitch: Follow us on Linkedin: Follow us on Instagram: ©2021 Advanced Micro Devices, Inc. AMD, the AMD Arrow Logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.